Engineering:Mini Small Outline Package
The Mini Small Outline Package (MSOP) is a miniaturized version of the small outline integrated circuit packaging format for integrated circuits.
Application
Many integrated circuits are available in the MSOP form factor. They are suited for space-limited applications requiring 1 mm or less mounted height and are commonly used in disk drives, video/audio and consumer electronics.[1]
Physical properties
The size of the Mini Small Outline Package is only 3mm × 3mm for the 8 and 10 pin versions[1] and 3mm × 4mm for the 12 and 16 pin version.[2][3] The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability.[1] Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB.[2][1]
| Part number | Pins | Body width (mm) | Body length (mm) | Lead pitch (mm) |
|---|---|---|---|---|
| MSOP8 | 8 | 3 | 3 | 0.65 |
| MSOP10 | 10 | 3 | 3 | 0.5 |
| MSOP12 | 12 | 3 | 4 | 0.65 |
| MSOP16 | 16 | 3 | 4 | 0.5 |
Synonyms
- μMAX or micro max - Maxim name for the msop package.[4][2]
- µMAX-EP or micro max exposed pad - Maxim name for the msop package with exposed pad.[2][4]
- MSE - Linear Technology name for the msop package with exposed pad.[2]
See also
References
- ↑ 1.0 1.1 1.2 1.3 "MSOP in STATS ChipPAC datasheet". https://datasheetspdf.com/pdf-file/685895/STATSChipPAC/TSSOP/1.
- ↑ 2.0 2.1 2.2 2.3 2.4 "MSOP on mbedded.ninja". https://blog.mbedded.ninja/pcb-design/component-packages/msop-component-package.
- ↑ "MSOP on EESemi.com". https://eesemi.com/msop.htm.
- ↑ 4.0 4.1 "Package Information - Maxim Integrated". https://www.maximintegrated.com/en/design/packaging/package-information.html.
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